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QSil 559


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TDS
SDS
Description
Addition Cure Potting Material
Feature
  • No solvent added
  • Long gel time
  • Good elongation / Low modulus
  • Repairable
Code
QSil 559
Feature
Feature 1
No solvent added
Feature 2
Long gel time
Feature 3
Good elongation / Low modulus
Feature 4
Repairable
Color
Gray
Color A
Beige
Color B
Black
Cure Type
Addition
Dielectric Constant
3.2
Dissipation Factor
0.003
Elongation at Break
110 %
Gel Time at 25°C/77°F
14 min
Hardness Shore A
50
Max Storage Temperature
54 °C
Max Working Temp
204 °C
Min Working Temp
-55 °C
Mix Ratio By Weight
1:1
Rheology
Liquid
RTV or Heat cure
RTV
Shelf Life
24 mths
Solids Content (%)
100 %
Specific Gravity A
1.31
Specific Gravity B
1.31
Tensile Strength
1.72 N/mm2
Test Conditions
Cured 15 min at 150C and tested at room temperature
Thermal Conductivity
~0.37 W/mK
UL 94V-0
3.0 mm
UL File No.
E205830
UL Listed
yes
Viscosity A
2,000 cP
Viscosity B
1,200 cP
Viscosity Mixed
1,600 cP
Volume Resistivity (Ohms cm)
1.16E+15 ohms cm
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